TSMC is considering a 10% to 20% price increase for advanced packaging services, primarily CoWoS technology used in high-end AI chips, according to Taiwanese media citing supply-chain sources as reported by BlockBeats. If implemented, the change could raise production costs for chip makers such as Nvidia and AMD.
Pricing plan remains unconfirmed
CoWoS integrates chips and high-bandwidth memory into one package for high-end AI accelerators. The report linked tighter capacity to rising demand, but the pricing plan remains under consideration and was not confirmed by TSMC.
Read the English BlockBeats flash (original Chinese: BlockBeats flash).