BlockBeats Premarket Roundup Covers HBM, Terafab, Meta Commitments and Claude Duet

BlockBeats listed several U.S. premarket corporate and technology headlines on Oct. 22, including new memory technology plans, Elon Musk’s chip and robotics targets, Meta’s cloud commitments and Anthropic’s Claude Duet launch.

Semiconductor and cloud plans dominate the roundup

SK hynix said it was moving iHBM toward mass production for next-generation products such as HBM5 and described a potential reduction of more than 30% in HBM thermal resistance. Micron said its 4F² architecture was not currently on its roadmap after more than two decades of evaluation; it plans to expand 6F² and develop 3D DRAM as a longer-term alternative.

BlockBeats also reported that Musk said his Terafab chip project was progressing toward some form of practical-chip mass production in the third quarter of 2028. Musk said humanoid robots could become the world’s largest industry and that Optimus might be delivered externally by the end of next year. These are forward-looking statements attributed to Musk.

Meta disclosed conditional cloud-capacity purchase obligations of up to $14.72 billion over five years as of Sept. 30, while the roundup separately cited $825 billion in future spending commitments. The figures have different scopes. BlockBeats also mentioned U.S. discussions about expanding “Trump accounts” eligibility and Anthropic’s Claude Duet agent for iOS, Android and the web. The flash did not provide primary documents for these items, so the claims should be read as an attributed premarket roundup.

Read the original BlockBeats flash.